While the use of blind vias has become fairly common in electronics manufacturing today, inspection of via holes during fabrication is still problematic. We take a look at a simple…
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Join Bob for three workshops in Malaysia during 7-9th August organised by Knowledge Group in Penang Bob Willis will be presenting three one day workshops as part of EPCONASIA 2018…
Here are links to our latest Book Review videos featured on the Bob Willis YouTube Channel If you are writing a book related to electronics and manufacturing and would like to feature…
Here are two of the latest books to be reviewed for the industry. We have many titles we have reviewed and featured on line for IPC, SMTA and Circuits Assembly…
Over the last few years I have been asked to examine examples of Ball Grid Array (BGA) defects which are referred to as dropped ball. This type of defect can…
The subject of outgassing, as it relates to printed circuit assemblies during the wave and selective soldering operation, has been an area of debate for many years. Until recently the…
Bob Willis and Peter Osborne from Chelmsford City Walking Football have put together a series of images of how to play and not play walking football. The aim is to play non-contact…
Defect of the Month Video – Solderability Testing Made Simple on your Shop Floor Using a simple production test anyone can test component solderability even BGA and BTC components for…
Its been a couple of years but looking forward to working at SMT Hybrid & Packaging in Germany one of the best and most relaxed exhibitions in Europe. We will…
Coming soon a new webinar and workshop on process and product failures due to dendrite formation on the surface of electronic assemblies. A simple and complete explanation of the subject…
