Posts
- Meet Bob Willis at SMTA Chicago 29-30th September
- QFN/LGA/BMC Failures - Causes and Cures Webinar Coming Soon
- Ball Grid Array Dropped Ball - Possible Reasons
- Fun & Work The Winning Combination
- Latest Book Reviews from Bob Willis
- Two New Book Reviews from Bob Willis
- Plan your engineering process improvement in 2018 with our monthly worldwide online webinars
- New Defect of the Month Videos from Bob Willis Online
- New Electronics Book Reviews from Bob's Desk
- Solder Ball Elimination – In Wave, Selective & Reflow Online Webinar
- NPL Electronics Interconnection Group Webinars 2016 Launched
- Rework Experience with Bob Willis at SMT Germany
- Three Days Only - Penang, Malaysia
- Bob Willis Guide to How to Produce your Own Microsections
- SMART Ireland Webinars with Bob Willis
- Join our Bob Willis Hand Soldering & De-soldering with Lead-Free Solder Webinar
- PPM or DPMO Your Soldering Yields
- Solder Balloons - Defect of the Month
- New Book Reviews for Electronic Assembly
- Join Assembly Soldering Inspection Defects LinkedIn Group
- Blind Via Hole Failures – First Level FA How to Do It!
- SMTA International Best of Conference Award Winner
- South Africa Seminars with SMART Group
- SMART Group Conformal Coating Defect Guide 2 Launched
- PowerPoint presentations on Conventional & SMT Assembly to Download
- Join Mr Clean for a Cleaning & Contamination Testing Workshop in Amsterdam
- Join Bob Willis & Lars Wallin in Paris for IPC/WHMA Wire Harness Manufacturing Conference
- Wire Harness & Crimping QC with Bob Willis
- Dendrite Failure – Causes & Cures a New Webinar from Bob Willis
- Who is Using Conductive Adhesives - What are the issues?
- Back at SMT Nuremberg this June for QFN & PCB Failure Workshops
- The Rework Experience - First in Germany & UK
- Defect of the Month Video - Solderability Testing Made Simple on your Shop Floor
- Hands On Production in Sweden plus September Conference
- Guide to QFN/LGA & BTC Process Defects launched for SMART Group
- Archive Webinar Recordings on Soldering, PCB Assembly & Inspection
- Hands on Master Class Series from Bob Willis
- Inspection Webinars for Vision Engineering
- PoP Package Open Circuit on TSV (Through Solder Via)
- Malaysia 2016 Workshops with Bob Willis
- Plan your Process Improvements in 2019 with our Monthly Worldwide Webinars
- Lead Free & Tin/Lead Wave Soldering Defect Guide to Download
- Meet Bob Willis & the Team at Productronica 2015
- LED Technology Bob Willis Shining a Light On Manufacture
- Solder Shorts & How to Eliminate Them – In Selective & Wave Soldering
- How to Play or Not Play Walking Football with Bob Willis
- Meet Bob and Lars in Holland ETECH 21-22nd September
- New Online Webinars from the Desk of Bob Willis
- Blowholes & Outgassing Of Printed Circuit Assemblies - Bob Willis Simple Test Method
- Coming Soon Manual Cleaning of Printed Board Assemblies – Step By Step Guide Webinar
- Back to Malaysia for the 16th Nepcon Workshop Master Classes
- NPL Improving Electronic Reliability - Downloads past Webinars FREE
- PCB Surface Finish Defect Guide launched FREE by SMART Group
- 2017 Online training webinars launched
- Robotic Iron & Laser Soldering for Lead-Free & High Temperature Alloys webinar
- Electronic Manufacturing Book Reviews from Bob Willis
- NPL Defect of the Month videos for IPC
- Final NPL Webinar of 2016 NPL Future of Interconnection Reliability - The Way Forward
- Join Bob Willis for Wave Soldering Lead-Free – Setting up Your Process Parameters
- Black Tar on Solder Pads & Joints
- Next Generation of Gold PCB Surface Finish Reducing Cyanide & Toxic/Corrosive Acids
- Plating, solder joint, cleanliness & blind via testing - How to do it videos online to support your staff training
- Announcing New NPL Webinar Titles for 2019
- Chinese Engineers visit Bob Willis in Chelmsford
- Plan your engineering process improvement with a monthly online webinar
- NPL EI Group 2017 Webinars Online
- Bob Willis Experience Exhibition Features & Defect Clinic Live
- Guide to Reflow Solder Spots on Your Boards
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- Crimping & Wire Cable Preparation
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- BGA Inspection & Lead-Free Defect Guide
- 0201 Chip Component Design, Assembly & Soldering Guide
- LGA/QFN Design, Assembly, Rework & Defect Guide
- Rework of Conventional & SMT 2
- Guide to Lead-Free Wave Soldering
- Guide to Simultaneous Double Sided Reflow Soldering
- Guide to Hand Soldering & De-Soldering Lead-Free
- Guide to Lead-Free Reflow Soldering
- Conventional & Surface Mount Process Introduction
- Printed Circuit Board Design & Lead-Free Defect Guide 2
- Wave Soldering Introduction & Defect Guide 2
- Ball Grid Array Optical Inspection
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