Posts
- Meet Bob Willis at SMTA Chicago 29-30th September
- QFN/LGA/BMC Failures - Causes and Cures Webinar Coming Soon
- Latest Book Reviews from Bob Willis
- New Defect of the Month Videos from Bob Willis Online
- Solder Ball Elimination – In Wave, Selective & Reflow Online Webinar
- NPL Electronics Interconnection Group Webinars 2016 Launched
- Rework Experience with Bob Willis at SMT Germany
- Bob Willis Guide to How to Produce your Own Microsections
- SMART Ireland Webinars with Bob Willis
- Join our Bob Willis Hand Soldering & De-soldering with Lead-Free Solder Webinar
- PPM or DPMO Your Soldering Yields
- Join Assembly Soldering Inspection Defects LinkedIn Group
- SMTA International Best of Conference Award Winner
- South Africa Seminars with SMART Group
- SMART Group Conformal Coating Defect Guide 2 Launched
- Join Mr Clean for a Cleaning & Contamination Testing Workshop in Amsterdam
- Join Bob Willis & Lars Wallin in Paris for IPC/WHMA Wire Harness Manufacturing Conference
- The Rework Experience - First in Germany & UK
- Hands On Production in Sweden plus September Conference
- Archive Webinar Recordings on Soldering, PCB Assembly & Inspection
- Hands on Master Class Series from Bob Willis
- Inspection Webinars for Vision Engineering
- Malaysia 2016 Workshops with Bob Willis
- Lead Free & Tin/Lead Wave Soldering Defect Guide to Download
- Meet Bob Willis & the Team at Productronica 2015
- LED Technology Bob Willis Shining a Light On Manufacture
- Solder Shorts & How to Eliminate Them – In Selective & Wave Soldering
- Meet Bob and Lars in Holland ETECH 21-22nd September
- Back to Malaysia for the 16th Nepcon Workshop Master Classes
- PCB Surface Finish Defect Guide launched FREE by SMART Group
- 2017 Online training webinars launched
- Robotic Iron & Laser Soldering for Lead-Free & High Temperature Alloys webinar
- Electronic Manufacturing Book Reviews from Bob Willis
- NPL Defect of the Month videos for IPC
- Final NPL Webinar of 2016 NPL Future of Interconnection Reliability - The Way Forward
- Join Bob Willis for Wave Soldering Lead-Free – Setting up Your Process Parameters
- Next Generation of Gold PCB Surface Finish Reducing Cyanide & Toxic/Corrosive Acids
- Chinese Engineers visit Bob Willis in Chelmsford
- Plan your engineering process improvement with a monthly online webinar
- NPL EI Group 2017 Webinars Online
- Bob Willis Experience Exhibition Features
- Guide to Reflow Solder Spots on Your Boards
Pages
Events
- PCB Microsectioning, Analysis of Failure & Quality Standards
- Solderability Benchmarking, Failures & Testing Methods
- PCB Outgassing & How to Test Bare or Assembled Boards
- Solder Shorts & How to Eliminate Them – In Selective & Wave Soldering
- Ball Grid Array, Bottom Mounted Component Design, Assembly, Inspection & Defect Elimination
Products
- High Temperature Soldering and Assembly
- Cleaning & Contamination Defects Photo CD-ROM
- High Temperature Inspection & Defects
- Cleaning & Contamination Defect Wall Charts
- Conference and AV
- Introduction to BGA Technology Video
- SMT/Conventional DFM Video
- Pin In Hole/Intrusive Reflow Assembly Video
- Conformal Coating Inspection Poster Guide
- Bob Willis Video Library 18 Subjects
- Package on Package (PoP) Assembly, Inspection & Rework
- PCB Solder Finish Poster Guide
- Conformal Coating Application, Inspection & Rework
- Conformal Coating Photo Album CD-ROM
- Counterfeit Component Identification Poster Guide
- Online Webinar Archive Booking
- Package on Package Assembly Photo CD-ROM
- Half Day Consultancy for PCB/Soldering Failures
- On Line Technical or Sales Presentation
- Package on Package (PoP) Inspection & Process Defects
- Ball Grid Array X-Ray Inspection
- Ball Grid Array & Area Array Soldeing
- Surface Mount Assembly & Soldering
- Lead-Free Assembly and Soldering Defects
- Printed Board Circuit Manufacturing Defects
- SMT & Conventional Component Recognition
- Pin In Hole Intrusive Reflow Assembly & Soldering
- Flip Chip Assembly & Soldering Defects
- 01005 - 0201 Design, Assembly & Soldering
- Crimping & Wire Cable Preparation
- LGA QFN BMC Assembly & Inspection
- Solder Paste Stencil Printing Inspection & Printing Defects
- BGA Inspection & Lead-Free Defect Guide
- 0201 Chip Component Design, Assembly & Soldering Guide
- LGA/QFN Design, Assembly, Rework & Defect Guide
- Rework of Conventional & SMT 2
- Guide to Lead-Free Wave Soldering
- Guide to Simultaneous Double Sided Reflow Soldering
- Guide to Hand Soldering & De-Soldering Lead-Free
- Guide to Lead-Free Reflow Soldering
- Conventional & Surface Mount Process Introduction
- Printed Circuit Board Design & Lead-Free Defect Guide 2
- Wave Soldering Introduction & Defect Guide 2
- Ball Grid Array Optical Inspection
- Pin In Hole Intrusive Reflow Assembly
- PCB Microsection Reference Charts
- Conventional Soldering Standards
- Static Training in Assembly
- Lead-Free Visual Inspection & Defect Guide
- Lead-Free Solder Paste Printing
- Lead-Free Shop Floor Solderability Testing
- SMT Rework & Repair Procedure
- QFN/LGA Assembly & Inspection
- Counterfeit Component Testing Photo CD-ROM
- Temperature Profiling for Reflow Soldering
- PPM DPMO Yield Monitoring during PCB Assembly
- Moisture Sensitive Device Component Handling
- Surface Mount Soldering Standards
- Hand Soldering/De-Soldering Components
- Conventional Component Recognition
- Basic Printed Circuit Board Manufacture
- Wave Soldering Defect Guide
- Printed Circuit Board Manufacturing Defects
- Conventional Wire Termination Standards
- Surface Mount Assembly Defect Guide
- Surface Mount Component Recognition
- Conventional Assembly & Soldering
- Online Webinar Booking
- SMT & Conventional Solder Joint Illustrations
- Pin In Hole Intrusive Assembly And Defect Guide 2
- Online Consultancy Meeting
- Company Specific Online Training
- One Day Consultancy for PCB/Soldering Failures
