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SMART Ireland Webinars with Bob Willis

By January 22, 2016News

SMART Group Ireland are hosting three online webinars presented by Bob Willis. “Bob has been a long standing supporter of the Ireland Group and we are very pleased to have him present on line with three of our new events” commented Philip O’RourkeAdministation /Director, Honorary Life Vice President

Please contact Philip O’Rourke of SMART Group Ireland on +353(0)86 806 1998 to reserve your space or email admin@smartgroupireland.com

The three webinars for 2016 cover the following technology topics

Package On Package Design, Assembly, Inspection & Common Failures Webinar
Wednesday February 17th 2016 2.30pm UK/GMT Time

Package on Package (PoP) applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers. In simple terms POP represents the stacking of components one on top of another either during the original component manufacture or during printed board assembly. As real estate is at a premium for logic and memory, PCB designers say the only way to go is up and up. POP packaging systems may include direct soldering, wire bonding or conductive adhesives for device to device interconnection. PoP is new to many contract and OEM assembly staff but with the demands of paste dipping, reflow warpage, increased placement accuracy/Z height control process introduction can be demanding. The difficulty in multi level ball inspection can be a challenge for x-ray equipment procedures as level one balls can mask level two and three interconnections. Manual inspection can be used but with these applications space is often not available for side viewing

Bob Willis the presenter is the author of the guide to POP Assembly, the first text book on POP and three other training aims on POP design and assembly

Topics covered:

What is Package on Package (PoP)?
Component standards
PCB design rules
Application of tack flux or dip paste
Optical and X-ray inspection
Rework and repair
Question and answer session
Area Array Design & Assembly including Underfill & Corner Bonding for Increased Reliability Webinar
Thursday 30th June 2.30pm

Ball Grid Array packages have been used in the industry for many years. Just like surface mount, the use of BGA’s can affect printed board layout, assembly, inspection and repair process. BGA’s do however provide significant advantages over fine pitch components particularly in terms of process assembly yield. Correct design, printing and profiling is necessary to obtain the highest yields and reliably interconnection. To increase robustness and long term reliability underfill and corner bumping with adhesives have become popular and is also a design consideration.

Everyone blames the BGA if failure occurs often because you can’t see under the package but is it the real failure mode. Bob produced the first video tape and interactive CD-ROM on BGA technology, practical advice is what you get on any of Bobs’ sessions supported by unique video clips to make the session come alive. All staff involved in the process of area array soldering with tin/lead and lead-free BGA assembly processes; including procurement, design engineers, reliability, quality personnel, failure analysts, and management involving is setting standards, inspection and product assessment of boards containing BGA, CSP, LGA and other area array components

The webinar will last approximately 90mins with question and answer session. A copy of the slides are provided directly after the webinar

Topics include:

Design rules
Printed board layout
Underfill and corner bumping benefits
Surface finish selection
Inspection/assembly marks
Assembly process
Rework procedures
BGA failures, Package cracking, Solder balls, Misalignment, Non reflow
Inspection criteria
LED Design Assembly and Soldering Process Issues Causes & Cures Webinar
Thursday 13th October 2.30pm UK/ GMT Time

LEDs Light Emitting Diodes are common in today’s industry, but now with the growing use of larger boards and more demanding devices there are challenges to each step in the assembly process. There are many different types of LED and limited interchangeability with parts from different suppliers

The components can be sensitive to moisture and contamination on the surface of the parts impacting performance. During the webinar Bob Willis will explain many of the process issues faced and how to overcome them in manufacture

Webinar topics include:

LED design requirements
Metal/epoxy PCB substrates
Component specification requirements
Changes to printing, placement and reflow
Soldering material considerations
LED failure modes
Inspection requirements

Presented by Bob Willis

The webinar will last approximately 90mins with question and answer session. A copy of the slides are provided directly after the webinar