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Practical Use of Low Temperature Solder, Assembly, Reflow & Inspection Workshop

16th and 17th June at The Low Temperature Soldering Conference 2021

Looking forward to being part of the first conference on Low Temperature Soldering in June with technical presentations before I give my workshop For further details and to book you place Click HereWho Will Benefit

Our workshop illustrates the practical use of LTS materials in reflow, selective and rework so the content should benefit Process and Quality Engineers. As inspection and defects are covered it will also be ideal for Product Operators, Supervisors and Line Managers tasked with its implementation

Special Bonus for Registered Delegates FREE LTS Wall Chats

Each delegate who registers for the workshop will be able to submit a question or process defect example prior to the session and receive feedback during the session. In addition, each delegate will receive a FREE set of wall charts coving the use of Low Temperature Inspection for future onsite training
We have produced sets of wall charts for training and a collection of Low Temperature Soldering and Assembly photographs that can be used in training, technical articles and social media promotions that are available to Download Here

Workshop Outline & topics

Low Temperature Soldering LTS is gaining significant interest in the industry to reduce cost, prevent component and PCB damage and improve reliability. It’s different but that does not mean it cannot be introduced into your process with existing process equipment. Generally speaking, solders used regally in assembly reflow at over 230oC, low temperature solders reflow at under 180oC

Many companies have been using tin/bismuth alloys for some years reducing cost on PCBs and energy. Other companies have been using tin/indium for rework of lead-free area array packages with success. There are savings to be made even if the cost of some solder alloy is more expensive provided you consider the total cost of manufacture. We produced the first book, video and interactive guide on Pin In Hole Intrusive Reflow, so we believe we are in a good position to help engineers achieve high yields with low temperature materials with standard assembly or PIHR

Topics

Why adopt low temperature soldering
Advantage over traditional lead-free solder
Materials options
Printing solder paste
Standard and epoxy pastes
Reflow soldering and rework results
Use in wave, selective and robotic soldering
Reliability with mixed alloys
Inspection results
Defect types and solder joint failures

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