New Book Review Videos Highlights Your Summer Reading

Bob Willis Book Reviews

Lots of new books this month, hopefully there is something that will have you visiting your bookshop or online service soon or in one cases your FREE download

Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
by Beth Keser & Steffen Kroehnert

BGA & Area Array Defect Guide
by Keith Bryant Yxlone & SMTA Europe

With our second review video we highlight more books for process engineers

Light Emitting Diodes
Materials, Proceses, Devices and Applications
Jinmin Li

Practical Guide to X-ray Inspection Criteria & Common Defect Analysis