Harsh Electronics with the SMTA Europe Team

Here is a guide to mission headquarters in the UK as a practice for the big day

I am very pleased to join delegates online for the SMTA Europe Harsh Electronics Conference and present two papers remotely.  I am please to say we have the A Team looking after things at the venue and the presenter in the UK at mission control. The SMTA Europe Conference is being held on 17 – 19th May Park Plaza Victoria Amsterdam, Netherlands

The papers being presented cover the following topics:

QFN/LGA Field and Process Failure Experiences – Causes & Cures

New components often provided challenges to design, process and quality engineers. Solder joint failure, voiding plus contamination & corrosion are just a few of the problems experienced so far with QFN/LGA. This type of area array package has become very popular in industry. However, any large area component with a low stand off which needs to be reflowed to a substrate can be a challenge. Ever decreasing pitch the need for good process validation and correct design is vital for high yields

Having had hands on experience with these parts during design reviews, setting up processes, conducting failure analysis we may not have all the answers, but we do know the right questions to ask in manufacture. Simple and first level failure analysis can often provide the cause of the failure and in many cases demonstrate it

manufacturing and training facility plus a copy of the QFN/LGA Photographic Defect Guide produced by the author

Topics to be covered during the presentation

Process improvements in design and assembly
Void reduction
Improvements in joint reliability
Simple 5min solderability assessment
Improved cleaning performance
Dendrite field failures
Process results from vapour phase and convection reflow
Solder joint reliability and failure