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Hands on Master Class Series from Bob Willis

By March 3, 2017News

For over 30 years we have been offering hands-On and theory workshops in all aspect of electronic assembly. From practical skills like manual soldering, component handling plus wiring and assembly to the most advanced area array, flip chip and laser soldering technology. If you have never seen Bob in action try out his free Defect of the Month” videos on line
Bob-Willis-webinar2017bWe always aim to make our events educational but also entertaining with as many practical real world examples as possible to make it relevant to operator, engineer and manager alike. We believe we offer the greatest range of training topics in the industry supported by our long running online webinars

The following is a range of the topics we offer but are always able to create new workshops

For further information or to book an onsite Bob Willis Master Class Workshop at your conference or manufacturing site Click Here

LED Design, Assembly & Soldering Process Issues – Causes & Cures
Cleaning Printed Circuit Assemblies, Design & Process Control
Package on Package (PoP), STACK Assembly, Rework and Inspection
LGA (Land Grid Array) QFN (Quad Flat No-lead) Design and Assembly
Laser & Robotic Iron Soldering for Electronics Assembly
PCB Microsectioning and Analysis of Failures
Printed Circuit Board Inspection and Quality Control
Practical Failure Analysis in Printed Board Assembly
High Temperature Assembly & Soldering Processes
Contamination Testing Methods for Printed Boards and Assemblies
Guide to MSL/MSD Moisture Sensitive Devices & PCB Control
Printed Circuit Board Failures – Causes and Cures
Lead-Free Selective Soldering, Design, Process Challenges and Practical Solutions
Void Formation in Solder Joints – Causes & Cures
Hands on Soldering and De-soldering
Hands on Surface Mount Rework and Repair
Practical Solderability Testing Workshop
Hands-On Cable Preparation, Crimping & Termination Workshop
Lead-Free Selective Soldering, Design, Process Challenges and Practical Solutions
Counterfeit Component Workshop- Causes and Cures
Troubleshooting Your Lead Free Assembly Yields – On Site or Offshore
Flexible Circuit Board Design and Assembly with Lead-Free Alloys
Lead-Free Wave Soldering Process Troubleshooting
Successful X-Ray and Optical Inspection in a tin/lead or Lead-Free Process
Lead-Free Selective Soldering, Design, Quality Control and Practical Solutions
Vapour Phase & Convection Reflow For Lead Free– Selecting Your Reflow Process
Conformal Coating Application and Inspection
Introduction to Conductive Adhesive Joints
BGA, CSP and Flip Chip PCB Design and Assembly
Counterfeit Component – Causes and Cures Workshop
Step by Step Ball Grid Array & Surface Mount Rework and Repair
0201-01005 & Smaller Component Design, Assembly and Inspection
Basic Printed Circuit Board Manufacture and Process Defects
Producing and Presenting Award Winning Technical Presentations
Double Sided Reflow Design and Assembly
Selecting Solderable Finishes for BGA and Fine Pitch Assembly
Ball Grid Array Technology Design, Assembly and Inspection
Practical X-Ray Inspection of BGA and Quality Standards
Printed Board Design for Manufacture and Assembly in Lead Free
Pin in Hole/Intrusive Reflow Design and Assembly
Part Per Million PPM Monitoring & Benchmarking Processes