Guide to QFN/LGA & BTC Process Defects launched by Bob Willis

Our latest Process Defect Photo Guide entitled “Guide to QFN/LGA & BTC Process Defects” will be released on 16th October. This optical and x-ray guide covers the most common components, assembly process and reliability failures that may occur using these parts. It shows issues at goods receipt, typical assembly related problems plus solder joint and cleanliness failures that can occur in the field. The guide provides example images of satisfactory print, placement, reflow with many common defects found with optical and x-ray inspection
Simply complete the form below and you will be sent a copy of the defect guide when release

QFN LGA & BTC Process Defect Guide