Printed Circuit Board Design & Lead-Free Defect Guide 2

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Printed board design and layout is the key to Zero Defect Manufacture and particularly true for lead-free. Design and development engineers must convert their build of materials to make all components lead-free and process compatible. This CD-ROM provides a basic introduction to Conventional, Surface Mount, Ball Grid Array and Pin In Hole/Intrusive Reflow Assembly including changes for lead-free with the following:

Conventional and surface mount layout
Surface mount and Conventional footprints
Resist, via hole, tracking and panel layout
Solder paste stencil rules
PCB layout & Design defects
Lead-free process defects