BGA Inspection & Lead-Free Defect Guide

£99.00 exc VAT

Out of stock


Interactive CD-ROM covering optical and x-ray inspection of solder joints produced jointly by Bob Willis. It includes an introduction to the lead-free assembly process with specific attention to BGA and area array devices. It provided a step by step guide to the procedure of inspection for optical and x-ray showing you how to do it. Inspection criteria are included for x-ray and visual criteria on different lead-free terminations and pad surfaces. The CD also includes many defect examples and causes as well as illustrating the reflow of different terminations with Bob Willis’s unique micro video clips