Name: Stencil Design for Solder Paste, In Process Inspection & Process Defects
Start: 2019-03-18T14:30:00+00:00
End: 2019-03-18T16:00:00+00:00
Location: Online Webinar

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Bob Willis Video Library 18 Subjects
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Introduction to BGA Technology Video
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Pin In Hole/Intrusive Reflow Assembly Video
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SMT/Conventional DFM Video
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Bob Willis Video Library 18 Subjects

Introduction to BGA Technology Video

Pin In Hole/Intrusive Reflow Assembly Video

SMT/Conventional DFM Video

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Stencil Design for Solder Paste, In Process Inspection & Process Defects

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