Package On Package Assembly Inspection & Quality Control is the first text book covering every step in this exciting manufacturing and design lead technology. This book is the second publication written by Bob Willis as a free download, his first on Pin In Hole Reflow has been read by over 3000 engineers worldwide and published by SMT magazine.

It was launched at IPC APEX Expo in cooperation with SMT magazine and available Now

The book contains 130+ pages, 12 sections, diagrams, colour images and x-rays. Once logged in to the website all of the guides and books can be obtained in the documents section of the website 

Topics will include:

Package On Package Assembly Overview
Component packaging
Printed Circuit Board Design
PCB Solder Finishes
Solder Paste Printing
Automatic Optical Inspection
PoP Component Placement
Convection & Vapour Phase Reflow & Profiling
Optical & X-ray Inspection
Cleaning PoP Assemblies
PoP Underfill & Staking
Rework & Reballing Package on Packages
Conformal Coating
Reliability Testing Package On Package
POP Process Assembly Defects
PoP Technical Training Material & Services
PoP Technical Paper Bibliography