The industry’s first PoP Package assembly training material, the format choice is yours, interactive CD-ROM, on line training session, inspection posters, photo CD ROM, hands on seminar for groups of engineering staff at your facility or our eBook?

Package on Package (PoP) applications are growing in popularity for mobile and handheld professional electronics applications and, with it, placing further demands on assembly engineers. In simple terms PoP represents the stacking of components one on top of another either during the original component manufacture or during printed board assembly. As real estate is at a premium for logic and memory, PCB designers say the only way to go is up and up. PoP packaging systems may include direct soldering, wire bonding or conductive adhesives for device to device interconnection. PoP is new to many contract and OEM assembly staff but with the demands of paste dipping, reflow warpage, increased placement accuracy and Z height control, process introduction can be demanding. The difficulty in multi-level ball inspection can be a challenge for x-ray equipment procedures as level one balls can mask level two and three interconnections. Manual inspection can be used but with these applications space is often not available for side viewing.

Topics covered on CD include:

What is Package on Package (PoP)?
Benefits of PoP Stack Packages
Component Standards
Component Types
JEDEC Standards
PCB Design Rules
Pad Layout
Via Hole Connection
Lead-Free Assembly
Engineering Interviews
Stencil Printing
POP Placement
Tack Flux Dip Solder Paste
Reflow Soldering PoP Packages
Convection & Vapour Phase
Temperature Profiling
Inspection
Optical Inspection
X-ray inspection
Underfill
Rework
Package on Package Defects

The CD-ROM is £99 plus VAT