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Void Formation in Solder Joints – Causes & Cures Webinar

March 19 @ 2:30 pm - 4:00 pm

| £65 Book a place for this online webinar

In preparation for the event and to ensure you are equipped to get the maximum benefit from the event, please read our simple Webinar Guidelines https://www.bobwillis.co.uk/wp-content/uploads/2017/01/WebinarAttendance2017.pdf

Voiding in solder joints is not new we have experienced cavities in solder joints during the introduction of through hole, surface mount and more recently area array technology. In many cases we never knew we have had voids till the introduction of x-ray inspection

Voids can be created in solder joints; your speaker once had the job of creating voids to order in solder joint of a known size. Voids can be seen in passive chip, J lead and gull wing and castellation terminations and we will show you how. Concerns were not really shown until area array technology started to increase in volume. Regardless of reliability voids or cavities on area array and large power devices will increase standoff, tilt devices and can mask other process issues

This session will examine and demonstrate all of the common reasons why voids can form in solder joints. It will also highlight all of the inspection criteria in existing international standards

Topics Covered:

Causes of void formation
Solder Paste volume
Via holes in mounting pads
PCB surface finish, outgassing
Component plating outgassing
Normal reaction from solder process
Non wetting or surface dewetting
Stencil design
Solder paste
Temperature profile
Component footprint

Presented by Bob Willis

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

All webinar times shown are UK time – to check your local time in your countries click here

Details

Date:
March 19
Time:
2:30 pm - 4:00 pm
Cost:
£65

Venue

Online Webinar
United Kingdom + Google Map