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Since the introduction of surface mount technology (SMT) components to the industry in 1980’s engineers have experience unplanned lifting of parts. These defects are referred to as tomstoning, drawbridge, Manhattan skyline, crocodiles or billboards the list is endless. Lifting of parts became common during the transition of manufacturing from ceramic hybrids to organic laminate PCB’s
Tombstoning can be seen directly after reflowing side one or two. The issue is experienced in convection, nitrogen, vapor phase and laser soldering. Some say it has increased with component becoming smaller moving from 0402 to 01005 chips. Through careful review and modification of process parameters some defects can be reduced, but not all
Lifting of components may not be detected on existing older AOI systems, but new advanced vision should be able to detect very subtle lifting leading to opens. With Bobs many video experiments delegates will be able to watch lifting taking place and be able to see some of the causes demonstrated on the webinar
In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide
Presented by Bob Willis
Topics included in our webinar:
Design rules for passive components
Pad sizes – solder mask – surface finish
Test boards and process trials
Klein Wassink/Philips calculations
Solder paste type & volume control
Reflow soldering
Convection/nitrogen, vapor phase & laser soldering
Inspection & defect analysis
Simple rework of lifted parts
After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example, they would like covered in the webinar, it will need to be provided in advance of the session
The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided in pdf format after the webinar
