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Successful X-Ray & Optical Inspection in a tin/lead or Lead-Free Process

May 20, 2019 @ 2:30 pm - 4:00 pm

| £65 Book a place for this online webinar

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Area Array Technology is part of mainstream electronics but until recently very few good inspection criteria were available in the industry. The assembly process for BGAs is fairly well understood for tin/lead alloys but with the move to lead-free assembly, new QFN and LGA packages there are critical issues to consider during inspection. The webinar covers optical and x-ray inspection of solder joints for both tin/lead and lead-free terminations. It includes an introduction to the lead-free assembly process with specific attention to BGA and area array devices. It provided a step by step guide to the procedure of inspection for optical and x-ray showing you how to do it. Inspection criteria are included for x-ray and visual criteria on different lead-free terminations and pad surfaces

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide

Presented by Bob Willis

Topics include

Procedures for inspection joints optically and by x-ray
Inspection criteria for joints
Identification of key joint features
Other indicators of possible failures
Common BGA & bottom mounted failures

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

Details

Date:
May 20, 2019
Time:
2:30 pm - 4:00 pm
Cost:
£65
Event Category:

Venue

Online Webinar
United Kingdom