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Stencil Design for Solder Paste, In Process Inspection & Process Defects

March 18, 2019 @ 2:30 pm - 4:00 pm

| £65 Book a place for this online webinar

All webinar times shown are UK time – to check your local time in your countries Click Here

The presentation provides a better understanding of solder paste selection and the use of stencil printing in modern fine pitch manufacture. Surface mount components are now at lead spacing of below 0.020″, only the correct selection of solder paste and specification of stencils can lead to effective printing. The session aims to provide a basic understanding of the design, production and quality control issues, both theoretical and practical issues of printing conventional surface mount and through hole for intrusive reflow

Topics included:

Design of lands and apertures for fine pitch SMT & BGA
Through hole printing requirements
Selection of stencils
Evaluation of solder pastes
Practical machine set-up and trial prints
Elimination of board wash-off
Assessment of paste and stencil combinations
Solder paste inspection, measurement and quality control
Stencil Inspection and quality control
Cleaning stencils
Printed board requirements for printing fine pitch

Presented by Bob Willis

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar


March 18, 2019
2:30 pm - 4:00 pm
Event Category:


Online Webinar
United Kingdom