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Solder Paste Stencil Printing, Inspection & Quality Control – Online Webinar

August 22, 2016 @ 2:30 pm - 4:00 pm

| £65 Book a place for this online webinar
The presentation provides a better understanding of solder paste selection and the use of stencil printing in modern fine pitch manufacture. Surface mount components are now at lead spacing of below 0.020″, only the correct selection of solder paste and specification of stencils can lead to effective printing. The session aims to provide a basic understanding of the design, production and quality control issues, both theoretical and practical issues of printing conventional surface mount and through hole for intrusive reflow
Presented by Bob Willis
Topics included:
Design of lands and apertures for fine pitch SMT & BGA
Through hole printing requirements
Selection of stencils
Evaluation of solder pastes
Practical machine set-up and trial prints
Elimination of board wash-off
Assessment of paste and stencil combinations
Solder paste inspection, measurement and quality control
Stencil Inspection and quality control
Cleaning stencils
Printed board requirements for printing fine pitch
After each webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session. A copy of the slides presented on the webinar are sent to delegates after the session. The webinar will last approximately 90 mins


August 22, 2016
2:30 pm - 4:00 pm
Event Category:


Online Webinar