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Solder balls and solder beading have been a process issue for many years and they may not cause product failure or quality problems but they are not desirable. Solder balls are caused by a variety of factors in different processes and should be resolved to eliminate a poorly defined process or a process and materials which are out of control With over 40 years in industry and 30 solving process problems for industry Bob Willis explains the causes and curses for solder balls
Bob’s webinar features many unique process video clips on testing and failures and make his sessions come alive providing a much better understanding of the root cause of failure and corrective action
Presented by Bob Willis
The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar
All webinar times shown are UK time – to check your local time in your countries click here
Topics covered include:
What are solder beads & balls?
What causes these defects?
Why does PCB design & specification matter?
Solder process & materials
Tin/lead v Lead-Free
Solder ball & bead formation
Causes/cures for random & designer balls