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Solder balls and solder beading have been a process issue for many years and they may not cause product failure or quality problems but they are not desirable. Solder balls are caused by a variety of factors in different processes and should be resolved to eliminate a poorly defined process or a process and materials which are out of control
With over 40 years in industry and 30 solving process problems for industry Bob Willis explains the causes and curses for solder balls. Bob’s webinar features many unique process video clips on testing and failures and make his sessions come alive providing a much better understanding of the root cause of failure and corrective action
In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide
Presented by Bob Willis
Topics included in our webinar:
What are solder beads & balls?
What causes these defects?
Why does PCB design & specification matter?
Solder process & materials
Tin/lead v Lead-Free
Solder ball & bead formation
Causes/cures for random & designer balls
After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example, they would like covered in the webinar, it will need to be provided in advance of the session
The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided in pdf format after the webinar