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Practical Failure Analysis Methods in Printed Board Assembly

October 14, 2019 @ 2:30 pm - 4:00 pm

| £65 Book a place for this online webinar

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Different levels of failure analysis exist, from the very basic with virtually no equipment, to the use of a full failure analysis laboratory. Often simple analysis methods can point engineers in the right direction, but proving the root cause of failure often needs the electronic pathologist with all his investigation tools. When conducting any failure analysis, it is important the results prove the cause of the fault. The true reason for failure needs to be clear and proven with hard facts, not just opinions.

Topics covered:

Optical and X-ray inspection
Solder joint crack detection
Microsectioning
Component opening techniques
Surface analysis
Shear testing
Question and answer session

Presented by Bob Willis

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The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

Details

Date:
October 14, 2019
Time:
2:30 pm - 4:00 pm
Cost:
£65
Event Category:

Venue

Online Webinar
United Kingdom