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PCB Outgassing & How to Test Bare or Assembled Boards

February 10, 2020 @ 2:30 pm - 4:00 pm

| £65 Book a place for this online webinar

Printed circuit boards outgas during soldering causing solder voids, solder balls and other process problems. Outgassing can occur in wave, selective and reflow soldering and it’s important first to non-destructively test samples to find the root cause. It’s possible to test bare or assembled boards to examine the potential for failure and eliminate some of the popular misconception in industry. There some different methods which can easily be conducted in manufacture before proceeding to costly laboratory analysis and we show you how to do it and the typical results you can find!!

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide

Presented by Bob Willis

Topics covered:

Type of outgassing from vias, through holes and solder masks
How to Test your own samples in manufacture
Test method procedures
Type of defects and how they can appear with tin/lead and lead-free alloys
Void formation in wave selective and PIHR joints
Correct specification of your boards

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example, they would like cover in the webinar it will need to be provided in advance of the session

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

Details

Date:
February 10, 2020
Time:
2:30 pm - 4:00 pm
Cost:
£65
Event Category: