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PCB Outgassing & How to Test Bare or Assembled Boards

September 11, 2017 @ 2:30 pm - 4:00 pm

| £65 Book a place for this online webinar

All our webinars are based on UK time you can check the time in your location Click Here

Printed circuit boards outgas during soldering causing solder voids, solder balls and other process problems. Outgassing can occur in wave, selective and reflow soldering and it’s important first to non-destructively test samples to find the root cause. It’s possible to test bare or assembled boards to examine the potential for failure and eliminate some of the popular misconception in industry. There some different methods which can easily be conducted in manufacture before proceeding to costly laboratory analysis and we show you how to do it and the typical results you can find!!

The webinar will last approximately 60-90mins including question and answer session

Presented by Bob Willis

Topics covered:

Type of outgassing from vias, through holes and solder masks
How to Test samples in manufacture
Test method procedures
Type of defects and how they can appear with tin/lead and lead-free alloys
Void formation in wave selective and PIHR joints
Correct specification of your boards

A copy of the slides presented during the webinar are provided at the end of the event along with a written procedure for testing


September 11, 2017
2:30 pm - 4:00 pm


Online Webinar
United Kingdom