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Passive 01005 & Beyond – Design, Assembly & Inspection Solutions

June 5, 2017 @ 2:30 pm - 4:00 pm

| £65 Book a place for this online webinar

All our webinars are based on UK time you can check the time in your location Click Here

With the ever-increasing miniaturisation and complex features of modern electronic products, there is a growing demand for more densely populated, smaller printed circuit boards. In general, the majority of devices used on a PCB are passives, therefore a reduction in component size from 0402 – 01005 will free-up PCB real estate. The introduction of 0201 or 01005 does however have its drawbacks. The pad sizes required are more difficult to etch, print, and parts required to be placed with a higher degree of accuracy. The reflow process may also cause defects through the movement of parts, whilst the package size makes inspection and repair more complicated. We will also illustrate the experience gained to date on a number of assembly trials

Bob has been active with small passive investigations over the last 10 years starting with 0201, 01005 and now the smallest parts half the size of 01005

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session

Each webinar last approximately 60-90mins with the opportunity for questions

Presented by Bob Willis

Topics include:

01005 0201 Chip Component Technology
Component Packaging issues
PCB Design Requirements
Stencil & Paste Implications
Chip Component Placement Requirements
Reflow Soldering Defects & Prevention
Defects caused by reflow
Rework & Repair methods for miniture chips

A copy of the slides presented during the webinar are provided at the end of the event



June 5, 2017
2:30 pm - 4:00 pm


Online Webinar