Loading Events

« All Events

Low Temperature Solder Benefits & Process Concerns

November 11, 2019 @ 2:30 pm - 4:00 pm

| £65 Book a place for this online webinar

All webinar times shown are UK time – to check your local time in your countries Click Here

The use of low temperature soldering is gaining interest in the industry to reduce cost, prevent component and PCB damage and improve reliability. Its different but that does not mean it cannot be introduced into your process with existing process equipment. Generally speaking, solders used regally in assembly reflow at over 220oC, low temperature solders reflow at under 180oC. There are some organisation predicting a large growth in low temperature materials in the next two to three years for multistep soldering

Many companies have been using tin/bismuth alloys for some years reducing cost on PCBs and energy. Other companies have been using tin/indium for rework of lead-free area array packages with success. There are savings to be made even if the cost of the solder alloy is much more expensive provided you consider the total cost of manufacture. We produced the first book, video and interactive CD-ROM on pin in hole intrusive reflow, so we believe we are in a good position to help engineers achieve high yields with low temperature materials

Topics covered

Why use low temperature solder
Benefit over lead-free alloys
Materials available
Reflow soldering and rework results
Reliability with mixed alloys
Inspection results

Presented by Bob Willis

To ensure you are equipped to get maximum benefit from the event, read our Webinar Guide

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

Details

Date:
November 11, 2019
Time:
2:30 pm - 4:00 pm
Cost:
£65
Event Category:

Venue

Online Webinar
United Kingdom