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Introduction to Ball Grid Array (BGA) Design & Assembly – Online Webinar

September 12, 2016 @ 2:30 pm - 4:00 pm

| £65 Book a place for this online webinar
Ball Grid Array (BGA) packages have been used in the industry for many years. They are now widely available for commercial and military use. Just like surface mount, the use of BGAs can affect printed board layout, assembly, inspection and repair process. BGAs do, however, provide significant advantages over fine pitch components particularly in terms of process assembly yield. This presentation provides an overview of the implementation of BGA from the creator of the first training videos, interactive CD-ROM and inspection criteria to industry
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Presented by Bob Willis
Topics include:
BGA advantages and disadvantages
Printed board layout
Pad and resist footprints
Surface finish selection
Inspection/assembly marks
Assembly process
Solder paste printing
Temperature profiling
Reflow by convection and vapour phase
Rework procedures
BGA failures including, package cracking, solder balls, misalignment, non reflow
Inspection criteria
After each webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session. A copy of the slides presented on the webinar are sent to delegates after the session. The webinar will last approximately 90 mins

Details

Date:
September 12, 2016
Time:
2:30 pm - 4:00 pm
Cost:
£65
Event Category:

Venue

Online Webinar

Organiser

Bob Willis