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Head in Pillow BGA Joints Causes & Process Solutions Webinar

February 19, 2018 @ 2:30 pm - 4:00 pm

| £65 Book a place for this online webinar

In preparation for the event and to ensure you are equipped to get the maximum benefit from the event, please read our simple Webinar Guidelines https://www.bobwillis.co.uk/wp-content/uploads/2017/01/WebinarAttendance2017.pdf

Open circuit and intermittent defects are the worst problem an engineer can face in manufacture, difficult to find and often a problem to get to the root cause. The increasing use of area array packages and package on package assembly combined with lead-free processes has highlighted a new defect type referred to as head in, or head on pillow. We explain the problem, process parameters and ways of eliminating this type of defect during assembly

This type of failure is not unique to lead-free or area array components we have been experiencing a similar problem in the past with fine pitch packages which will also be illustrated during Bob’s webinar

Topics Covered:

What is Hip and Hop
Same defect type on surface mount
Solder sphere oxide
Solder sphere and package wetting tests
Reducing void formation in reflow
PCB/Component Package Warpage
Solder paste exhaustion
Reflow profile correction
Test methods and simulations
Pry testing
Inspection optically and with x-ray

Presented by Bob Willis

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar


February 19, 2018
2:30 pm - 4:00 pm


Online Webinar
United Kingdom