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Handling Moisture Sensitive Devices & PCBs – Without Failure

August 9 @ 2:30 pm - 4:00 pm

| £65 Book a place for this online webinar

Webinar times shown are UK time – to check your local time in your country  Click Here

Fine pitch surface mount components and printed circuit boards all absorb moisture at different rates. During soldering moisture turns to water vapour and can generate considerable internal stress which may lead to premature failure. In the case Quad Flat Packs (QFPs) and Plastic Ball Grid Arrays (PBGAs) the resulting defect is often referred to as “popcorning” due to the sound of steam escaping from the package. When printed circuit boards outgas you see minor soldering faults, full delamination, blistering of the board or very subtle via hole failure

Considerable research into the correct procedures to minimize problems with bare boards and components has culminated in IPC standards to help guide engineers to reduce the possibility of failure. Bob has put together a session on each of the issues associated with the prevention of failure, correct onsite operating procedures and the equipment than can be used to store products and eliminate failures of this type

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide

Presented by Bob Willis

Topics included in our webinar:

Component and PCB failures
Baking components and PCBs
Moisture absorption rate and loss
Impact of baking on solderability
Methods of moisture absorption
Benefits of dry storage
Baking assemblies prior to rework
Storage methods and failure analysis 

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example, they would like covered in the webinar, it will need to be provided in advance of the session

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided in pdf format after the webinar

Details

Date:
August 9
Time:
2:30 pm - 4:00 pm
Cost:
£65
Event Category:

Venue

Online Webinar
United Kingdom

Organiser

Bob Willis
Phone:
(44) 01245 351502
Email:
bob@bobwillis.co.uk
Website:
www.bobwillis.co.uk