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Dendrite failure on printed circuit board assemblies is quite common but often not investigated fully to pinpoint the root cause. This is due to the intermittent nature of the failure as just replacing components seems to solve the problem. Dendrites are a metallic growth between conductive surfaces which form an intermittent connection causing intermittent product operation or dramatic failure. They can be caused by incorrect material specification, incorrect environmental protection or poor manufacturing control and lack of cleanliness. Our presenter has investigated many failures over the years as well as experience in testing soldering materials both clean and no clean
Dendrites can be copper, silver or other metals forming a fern like structure across insulated surfaces. Depending on situations and the level of moisture a conductive path can form over components, around solder mask and under conformal coatings
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Presented by Bob Willis
What is a dendrite?
Where do they form?
What causes dendrite formation?
Common causes and locations of failure
Does cleaning or conformal coating help?
Can you test materials and product reliability?
After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example, they would like covered in the webinar, it will need to be provided in advance of the session