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BGA X-Ray and Optical Inspection Criteria – Online Webinar

November 7, 2016 @ 2:30 pm - 4:00 pm

| £65 Book a place for this online webinar
Area Array Technology is part of mainstream electronics but until recently very little inspection criteria were available in the industry. The assembly process for BGAs is fairly well understood for tin/lead alloys but with the move to lead-free assembly, new QFN and LGA packages there are critical issues to consider during inspection. The webinar covers optical and x-ray inspection of solder joints for both tin/lead and lead-free terminations. It includes an introduction to the lead-free assembly process with specific attention to BGA and area array devices. It provided a step by step guide to the procedure of inspection for optical and x-ray showing you how to do it. Inspection criteria are included for x-ray and visual criteria on different lead-free terminations and pad surfaces
voids
Presented by Bob Willis
Topics covered:
Lead-free Alloys – BGA – Area Array – Land Grid Array Reflow
Inspection Techniques
Inspection Procedures – Optical Inspection – X-Ray Inspection
Industry Inspection Criteria
Common process problems
Defect Guide
After each webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session. A copy of the slides presented on the webinar are sent to delegates after the session. The webinar will last approximately 90 mins

Details

Date:
November 7, 2016
Time:
2:30 pm - 4:00 pm
Cost:
£65
Event Category:

Venue

Online Webinar