Ball Grid Array or area array packages have been used in the industry for many years and widely available for commercial and military applications. Everyone blames the BGA for failure, often because you can’t see under the package but is it the real failure in your process. Bob will outline the correct assembly process and the most commom failure modes and your corrective action. Just like surface mount, the use of BGA’s can affect printed board layout, assembly, inspection and repair process. However BGA’ s provide significant advantages over fine pitch components on assembly yield.
During each webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session.
Presented by Bob Willis over 60-90min with Q&A
Topics will include:
- Modern Lead-Free Assembly Processes
- Issues with Plastic BGA, Ceramic BGA, Column Grid Array, Land Grid Arrays
- Lead-free and tin/lead paste
- Moisture cracking
- Effect of incorrect profiling<
Cost excludes VAT which will be added at Checkout