Today the most common methods of inspecting solder joints on Ball Grid Array, Chip Scale Package (CSP) or Flip Chip is X-ray or side view inspection using a fiber optic system. Each has its advantages and disadvantages but a combination of both is ideal provided you can justify both pieces of process equipment.
One area which is still difficult to detect is the subtle open circuit caused by wetting problems on the pad surfaces or flex of the BGA or printed board. Wetting problems are more common than some people think. This is particularly true on nickel/gold finished boards. In this case the gold is dissolved into the solder during reflow as the solder wets across the pad surface but a joint can fail to form between the base nickel. This type of defect is difficult, if not impossible, to detect with either of the traditional inspection techniques.
Dye penetrants have been used for many years for a variety of applications, the most common being the testing of welded joints and castings prior to destructive analysis. They have also been used in surface coatings to detect minor imperfections. In the case of BGA, CSP and flip chip it is simple to mechanically break or flex the component from the board and check where the joint may have failed. The dye however provides a much better indicator of where complete or partial fractures may have taken place before the component is removed from the board. The surface of the joints can then be examined for dye penetration.
Presented by Bob Willis over 60-90min with Q&A. The webinar booking fee is for ONE logon which can only be used on ONE PC, either for an individual or a group in a conference room. For further information to enhance your teams webinar experience Click Here
- Benefits of destructive Examination
- Why do Dye and Pry
- Printed Board Assembly Preparation
- Selective the Correct Dye
- The Need for Vacuum?
- Removing Area Array Devices in One Piece
- Correct Identification of Failure
- Common Examples of Failure and Cure
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