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BGA & Area Array Failures, Causes & Corrective Actions

March 16, 2020 @ 2:30 pm - 4:00 pm

| £65 Book a place for this online webinar

All webinar times shown are UK time – to check your local time in your countries Click Here

Ball Grid Array or area array packages have been used in the industry for many years and widely available for commercial and military applications. Everyone blames the BGA for failure, often because you can’t see under the package but is it the real failure in your process? Bob will outline the correct assembly process, the most common failure modes and corrective action. Just like surface mount, the use of BGAs can affect printed board layout, assembly, inspection and repair process. However, BGAs provide significant advantages over fine pitch components on assembly yield

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide

Presented by Bob Willis

Topics included in our webinar:

Modern Lead-Free Assembly Processes
Issues with Plastic BGA, Ceramic BGA, Column Grid Array, Land Grid Arrays
Lead-free and tin/lead paste
Moisture cracking
Effect of incorrect profiling
Head in or on Pillow
Secondary reflow
Hot tearing of joints
Voiding in solder joints

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like covered in the webinar, it will need to be provided in advance of the session

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

Details

Date:
March 16, 2020
Time:
2:30 pm - 4:00 pm
Cost:
£65
Event Category:

Venue

Online Webinar
United Kingdom