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Ball Grid Array Rework – How to Do It Successfully

May 4, 2020 @ 2:30 pm - 4:00 pm

| £65 Book a place for this online webinar

All webinar times shown are UK time – to check your local time in your countries Click Here

Surface mount and BGA rework and repair can be straight forward if simple rules are followed. This presentation will give each delegate a step by step blueprint to introduce rework successfully into manufacture. Guidelines will be given on selecting rework equipment, materials and training procedures for defect free soldering. Bob Willis was the creator of the world’s first video tapes and interactive CD-ROM on BGA Technology, X-Ray Inspection and BGA Rework which are sold worldwide by IPC and SMTA

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide

Presented by Bob Willis

Topics included:

Introduction to rework, where and why rework
Soldering standards & defects, IEC, IPC, BT standards
Temperature profiling rework sites

Rework methods for:
BGA, CSP and other area array package
Hot gas/IR systems
Rework of single/double sided boards
Reballing BGA
Rework related defects

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example, they would like cover in the webinar it will need to be provided in advance of the session

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

Details

Date:
May 4, 2020
Time:
2:30 pm - 4:00 pm
Cost:
£65
Event Category:

Venue

Online Webinar
United Kingdom