Non wetting of the toe of leaded surface mount devices is common and will continue to occur with the greater use of no clean low residue pastes. The lead tip when formed and cut during component manufacture is left exposed with no protective coating. It oxidises during storage and is very difficult to solder. The toe of the lead is not covered in the component manufactures specification or in the solderability standards. The inspection standard should not reject joints where no wetting is visible at this point.