Component cracking is normally due to the incorrect use or specification of the component. Initially check the suppliers maximum soldering temperature and duration. Also consider any other special requirements for component storage.

The most common cause, as in the case of the example, is excess heat. If the component supplier specifies the maximum temperature for reflow of <220oC or 240oC for wave solder the component should not have been designed into the product. A poor design for manufacture practice. Components can be assessed against the IPC or IEC process compatibility specifications.