 |
 |
|
|||||||||||||||
 |
|||||||||||||||||
|
|||||||||||||||||
|
|||||||||||||||||
| A PDF version of this sheet can be obtained here. | ||||||||||
|
Non Reflow
|
||||||||||
 |
||||||||||
|
Solder paste needs to be raised above its liquid temperature to reflow and then form a joint by wetting both surfaces to be joined. If the temperature is not reached or not held for sufficient time the paste will not completely flow, as in the example shown. |
||||||||||
|
||||||||||
|
|
For
further information on PPM Monitoring and this SMART Group initiative,
contact:
Bob Willis - info@ppm-monitoring.com |
|