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| A PDF version of this sheet can be obtained here. | ||||||||||
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Component Lifting
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Solder paste under components can cause the parts to lift before both terminations have soldered. In this case the same causes attributed to solder beading apply; it is only the end results which are different. |
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For
further information on PPM Monitoring and this SMART Group initiative,
contact:
Bob Willis - info@ppm-monitoring.com |
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