Many chip capacitors and variable resistor still have a silver palladium coating as the solderable surface during assembly. During soldering with tin/lead alloys the coating is readily soluble in the solder in its liquid state.

Normally a silver loaded solder paste or wire is used which reduces the degree to which the silver plating is leached from the termination. A more common practice is to specify a nickel barrier layer on the parts with a tin/lead solder coating. This prevents the leaching occurring during assembly.