Cracked chip components found after reflow soldering are not that likely to be caused by reflow. They are more likely to be caused by component placement or result through poor handling after reflow, examples of which are in circuit test suck down onto the test fixture or breaking out of multiple boards.

Component compatibility testing should always be done on suppliers parts prior to approval or for new suppliers.

Cracking has been seen recently on components passing through reflow ovens with poorly adjusted centre board support damaging components on second side reflow. Support fixturing for screen printing and component placement of the second side assembly should also be reviewed.