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Wave
Soldering
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This section has been developed to help you identify many of the common problems that may arise within the PCB production process. The guides explain how and why these occur and what steps may be taken to rectify them. |
 Blow Hole |
 Bulbous Joint |
 Cracked Joint |
 Cracked Solder Joint |
 Lifted Component |
 Flux Residues |
 Incomplete Joint |
 Inconsistent Hole Fill |
 Incomplete Solder Joint |
 Joint Contamination |
 Lifted Component |
 Lifted Pads |
 Lifted Resist |
 Pad Contamination |
 Pin/Blow Hole |
 Poor Hole Fill |
 Poor Hole Fill |
 Poor Hole Fill |
 Poor Hole Fill |
 Poor Hole Fill |
 Poor Hole Fill |
 Poor Lead Solderability |
 Poor Lead Solderability |
 Poor Penetration |
 Poor Solder Penetration |
 Poor Via Hole Fill |
 Poor Wetting |
 Poor Wetting |
 Poor Wetting |
 Poor Wetting |
 Poor Wetting |
 Poor Wetting |
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 Poor Wetting |
 Poor Wetting |
 Outgassing |
 Solder Ball |
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 Solder Ball |
 Solder Balling |
 Solder Balling |
 Solder Balling |
 Solder Balls |
 Solder Flags |
 Solder Flags |
 Solder Short |
 Solder Short |
 Solder Short |
 Solder Short |
 Solder Short |
 Solder Short |
 Solder Shorts |
 Solder Shorts |
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 Solder Skip |
 Solder Skips |
 Sunken Joint |
 Sunken Joints |
 Sunken Joints |
| Choose from the defect selector above |
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For
further information on PPM Monitoring and this SMART Group initiative,
contact:
Bob Willis - info@ppm-monitoring.com |
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