 |
The
actual PPM level from each company per process stage |
|
The
PPM level against the PCB technology level being assembled |
|
The
type of materials and PCB solder finishes |
|
The
size of company and production throughput |
|
The
process parameters being used as listed below: |
| |
| SOLDER
PASTE PRINTING |
|
COMPONENT
PLACEMENT |
| Stencil
Printing Type |
|
PCB
Finish |
| Printer
Climate Control |
|
Component
Vision/Mechanical Centring |
| Stencil
Type |
|
Printing |
| Frame
Type |
|
PCB
Thickness |
|
Solder Paste MeasuremenT |
|
Printing |
|
Board Support Type |
|
Printing |
| Squeegee
Blade |
|
Printing |
| PCB
Finish |
|
Technology
Level |
| Paste
Alloy |
|
Number
of Samples |
| Paste
Type |
|
Number
of Components per PCB/Panel |
| PCB
Thickness |
|
Number
of Component Defects |
| Technology
Level |
|
|
| Number
of Samples |
|
|
| Number
of Apertures per PCB/Panel |
|
|
| Screen
Print Defects |
|
|
| |
|
|
| REFLOW
SOLDERING |
|
WAVE
SOLDERING |
| Number
of Zones |
|
Number
of Waves |
| Oven
Length |
|
Air/Nitrogen |
| Air/Nitrogen |
|
PCB
Finish |
| PCB
Finish |
|
PCB Thickness |
|
PCB Thickness |
|
Conveyor/Transport
Type |
|
Number of Layers |
|
Flux
Type |
| Paste
Alloy |
|
Number
of Layers |
| |
|
Technology
Level |
| |
|
Number
of Samples |
| |
|
Number
of Joints per PCB/Panel |
| |
|
Number
of Wave Solder Defects |
| |
|
|
|
| |
| GENERAL
PRODUCTION ENVIRONMENT |
|
|
| Full
Air Conditioning/RH Control/Air
Conditioning |
|
|
| Number
of Boards Produced per Week |
|
|
| Typical
Batch Size |
|
|
| How
Many Product Change Overs per Day |
|
|
| Company
Size |
|
|
|
