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The workshop's aim was to discuss the project,
the benefits gained so far and to suggest future improvements to
the defect data gathering. There was also discussion on the methods
of future support and the ways in which the results cab be best
disseminated in the future. After much discussion the project will
now be including the collection of defect types and the components
most affected at each of the manufacturing stages, which currently
include screen print, placement, reflow and wave soldering. This
will help engineers improve design rules for future products based
on the published assembly yields. All companies represented agreed
that the project was very worthwhile, a benefit to the industry
and a credit to the SMART Group.
In addition to the PPM discussions Bob Willis and
Alan Brewin from NPL discussed different ways in which solderability
had a direct impact on PPM yields.
Solderability Testing
and Soldering Defect Levels - Alan Brewin
The advantage of solderability testing as a QA tool was highlighted
by the link to resulting soldering defect PPM levels on products.
The techniques were described and examples illustrated on how discrimination
between good and bad levels of solderability on incoming parts are
achieved. Wetting force determination using a wetting balance provides
a measurement of the solderability of component leads or board finish.
NPL is currently undertaking work to improve the
test method by better modelling production practice into the measurements.
New test fluxes and sample pre-heating are approaches that are under
evaluation. There is opportunity for UK companies to benefit from
testing on their parts and materials within the project to link
the component types or finishes which are shown to give the highest
defective PPM levels.
Production Solderability
Testing Made Simple - Bob Willis
Although there is no substitute for solderability testing using
defined measurement and documented standards production testing
is often necessary. If parts fail using a simple production test,
parts can be re-tested in line with current standards prior to rejection
to suppliers. In the real world of production, do parts solder or
do they not?
Bob Willis illustrated a simple test method that
anyone could use and hopefully can be calibrated in the future with
standardised techniques and help engineers understand the real cause
of many soldering defects. Examples and case studies of Bob's work
were shown along with some of his unique video clips, some of which
are shown in the SMART Group's members' area.
To get a copy of Alan
Brewin's paper click here.
For Bob Willis paper click here.
If you want to keep up to date with the SMART Group
PPM Monitoring Project monthly results or participate in the project
visit www.ppm-monitoring.com
or email info@ppm-monitoring.com
The PPM Monitoring Project is unique as there is
no other collaboration of companies producing this type of data
and providing it to the industry FREE.
Some of the issues discussed are summarised here
and are produced from notes made by Peter Grundy, Siemens, who was
volunteered by Bob to be the scribe.
Some of the changes will be incorporated over the
coming months and fully documented on the PPM website.
CHANGES DISCUSSED
It was requested that changes to processes should be included
in any monitoring so that, for example, if an aperture in a stencil
is changed because of insufficient bridging, the subsequent performance
of the joint is monitored for success or failure.
If month 1 is all level 3 but month 2 is all level
1, how does this affect the results? Can we track changes in levels
to go with defect types?
It was requested that the mean value of faults
per month be recorded rather than the average to avoid distortions.
It was suggested that any results for lead-free
statistics be separated out into a new project. This may need funding
from other projects.
It was suggested that defects be categorised against
set-up criteria, e.g. defect vs stencil type/thickness or defect
vs component size (0201 vs 1206)
If we expand the criteria for data collection,
will it put off participants from contributing as regularly as they
do now?
Chris Hunt offered a CD with a catalogue of NPL's
defects as collected by Martin Wickham for free distribution to
Group members. All agreed this is a good idea.
In order to expand the data set and get more useful
results it was agreed that defects should also be collated against
component types. This will automatically add number of terminations
and pitch into the equation. If we use this terminology will it
replace the levels already used? It was decided to run both in parallel
and see if there is too much data to collect sensibly or whether
we can abandon levels in future.
It was suggested that we could focus on one type
for a month and analyse it in greater detail so that the most accurate
pareto of its propensity for faults can be established. The Defect
of the Month was found to be useful.
The current spreadsheet recording method was widely
accepted and it was requested that all defects be logged against
all component types.
If we offer to expand into Europe or beyond with
the survey, we should add a country code to establish if some faults
are regional.
Wave soldering unchanged. Proposal to add a level
4 which is the same as level 3 but including array packages and
difficult technology items such as 0201
Those contributors who can evaluate all joints
on array packages and give good defect feedback will use level 4.
Those placing arrays or 0201s but cannot provide quantitative data
should remain at level 3.
As expanded data becomes available, spreadsheets
will be used on the website to analyse and display results for all
defects and aspects of production.
Add the appropriate industry sector to each member
in case some faults are indigenous to a particular sector.
Once component type vs defect data is gathered,
prepare and issue top 5 hit list of problems and include industry
sector.
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