Nepcon Electronics 2002 in Birmingham, England incorporated the SMART Group PPM Monitoring Feature Area which allowed engineers to logon to the latest updates on the SMART Group PPM Monitoring Project web site. This included the average defect yields provided from the 18 contributing companies for May, June, July, and August.

Bob Willis, PPM Monitoring co-ordinator for the SMART Group was on hand to show engineers what had been achieved so far with the project, how the web site can work to support small and medium volume companies with information and linked into the IPC process monitoring procedures and the criteria required under IPC 610 level 3.

Visitors were also able to look through the interactive Defect Guides for the main process stages. These are a unique tool to train staff on the causes and cures of defects at the key stages of manufacture, paste print, place, reflow and wave solder. The PPM Monitoring website also allows engineers to send Acrobat pdf files of process defects to other engineers to help explain process issues.

During the Technology Seminars a presentation was given on the PPM project and the latest average yields for screen printing, component placement, reflow and wave soldering. A copy of the presentation can be obtained from the download section of the web site.

The presentation was attended by 59 engineers who each received a copy of the new PPM Monitoring Brochure which provides details on the project and how companies can benefit from monitoring their processes. The PPM Monitoring presentation was one of the most popular at this year's event.

Companies who participate with the PPM Monitoring project and contribute results each month benefit by gaining access to all the anonymous PPM yields in the members area and listings of all the process information used on the process from which the yields were obtained. This includes stencil type, thickness, paste alloy, reflow process, PCB solder finish etc. and the technology level of the boards inspected as part of the sample, including component type and lead pitch.

As the project progresses the contributing companies will also be able to view the defect types at each stage of manufacture and the component types most affected. Participating companies are also encouraged to suggest changes and improvements to the information provided.