1. Tin/lead contamination
2. Resist failure
3. Resist crinkle
4. PCB delamination
5. Uneven levelling
6. Uneven tin /lead
7. Plating failure
8. Legend contamination
9. Resist contamination
10. Chip Leaching
11. Poor solderability
12. Plastic cracking
13. Capacitor cracking
14. Poor solderability
15. Plastic softening
16. Capacitor cracking
17. QFP cracking
18. Poor coplanarity
19. Solder beading
20. Poor solderability
21. Crystallised joints
22. Cracked joint
23. Poor pad wetting
24. Component lift
25. No wetting
26. Joint failure
27. Joint voiding
28. Poor solderability
29. Solder beading
30. Solder beading
31. Solder wicking
32. Component lifting
33. Solder wicking
34. Solder wicking
35. Solder wicking
36. Solder short
37. Non reflow
38. Solder short
39. Solder short
40. PCB measelling
41. Component lifting
42. Solder beading
43. Open joints
44. Cracked joint
45. Non reflow
46. Component cracking
47. Open joint
48. Non reflow
49. Solder balling
50. Poor penetration
51. Solder balling
52. Solder skip
53. Bulbous joint
54. Poor wetting
55. Poor wetting
56. Solder short
57. Solder skip
58. Solder short
59. Solder balls
60. Solder shorts
61. Blow hole
62. Solder skip
63. Solder skip
64. Incomplete joint
65. Bulbous joints
66. Solder webbing
67. Adhesive contamination
68. Adhesive stringing
69. Adhesive contamination
70. Adhesive shorts
71. Excess adhesive
72. Skipped pads
73. Paste slump
74. Poor wash-off
75. Solder balling
76. Smudged print
77. Uneven print
78. Misaligned dispense
79. Smudged print
80. Misaligned print
81. Smudged print
82. Cracked component
83. Incorrect placement
84. Misplaced lead
85. Misplaced component
86. Excess flux
87. Dendrite growth
88. Corrosion
89. Dendrite growth
90. Corrosion
91. Joint damage
92. PCB burning
93. Poor wetting
94. Solder spikes
95. Flux residues
96. Joint cracking
97. Pad lifting
98. Solder voids
99. Solder voids
100. BGA misplacement
101. BGA cracking
102. BGA cracking
103. Poor washing
104. Ball failure
105. BGA cracking
106. Joint cracking
107. Reflow joints assembly
108. Wave solder joints assembly
109. Fine pitch paste bleed
110. Misaligned print
111. Incorrect stencil alignment
112. Satisfactory print
113. Incomplete paste print
114. Satisfactory print
115. Misaligned print
116. Poor paste washoff
117. Smudged print
118. Misaligned print
119. Dogeared print
120. Smudged print
121. Misaligned print
122. Stencil squashed print
123. Stencil squashed print
124. Poor stencil paste release
125. Misaligned print
126. Smudged print
127. Smudged print
128. Misaligned print
129. Scooped print
130. Scooped print
131. Satisfactory print
132. Minor misalignment
133. Minor misalignment
134. Smudged print
135. Misaligned re-print
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