1. Square paste print
2. Split paste deposit
3. Round paste deposit
4. Bleeding on split deposit
5. Square paste print
6. Split paste deposit
7. Square paste deposit
8. Incomplete paste reflow
9. Square paste deposit
10. Incomplete paste deposit
11. Square/Round paste
12. Smeared round paste
13. Incomplete reflow
14. Body displaced paste
15. Body displaced paste
16. Body displaced paste
17. Paste with PGA inserted
18. Displace paste deposit
19. Displaced paste deposit
20. Displaced paste deposit
21. Base of pin header
22. Base of pin header
23. Base of two headers
24. Base of pin header
25. Balling due to header
26. Solder balling on resist
27. Balling due to header design
28. PGA solder fillets
29. PGA solder fillets
30. Topside solder fillets
31. Poor wetting on hole wall
32. Balling due to header
33. Lifting of header
34. Lifting of header
35. Lifting of header
36. PGA solder fillets
37. PGA solder fillets
38. Connector fillets
39. PGA solder fillets
40. PGA solder fillets
41. PGA solder fillets
42. Topside PGA fillets
43. PGA solder fillets
44. PGA solder fillets
45. Poor hole wetting
46. Solder balling on resist
47. Dried paste displacement
48. Dried paste displacement
49. Hole paste displacement
50. Hole paste displacement
51. Hole paste displacement
52. Paste hole fill
53. Hole paste displacement
54. Dried paste displacement
55. Hole paste displacement
56. Long pin displacement
57. Microsection with solder ball
58. Microsection with void
59. Microsection of PGA lead
60. Microsection with void
61. Section with poor wetting
62. Microsection with small void
63. Pin with thick solder coating
64. Microsection with minor voids
65. Solder balls/poor solder fill
66. Poor solder fill
67. Poor solder fill
68. Poor solder fill
69. Satisfactory solder fill
70. Microsection of joint
71. Microsection with minor voids
72. Solder balls on pin
73. Microsection with ball
74. Microsection with solder ball
75. Microsection with solder ball
76. Microsection of PGA pin
77. Microsection of joint
78. Microsection with solder ball
79. Pin with thick solder coating
80. Microsection with voids
81. Microsection of satisfactory joint
82. Microsection with minor voids
83. Microsection with minor void
84. Microsection with minor void
85. Microsection with minor void
86. Microsection with minor void
87. Variable solder joints
88. Variable solder joints
89. Through hole coils inserted
90. Through hole pins/pads
91. Reflowed though hole pins
92. Dispensed paste deposits
93. Dispensed paste deposits
94. Edge connector reflow
|