1. Microsection of plated through hole
2. Microsection of inner layer
3. Microsection with laminate voids
4. Microsection of pad with tin/lead
5. Manual microsectioning
6. Microsection plated through hole
7. Microsection of copper voids
8. Horizontal microsection of resin smear
9. Microsection with poor solderability
10. Horizontal section hole misalignment
11. Cracking on corner of PTH
12. Tin/lead overhang and undercutting
13. Section showing ring voiding
14. Section showing burring on through hole
15. Voiding on through hole plating
16. Poor solderability on knee of the hole
17. Copper hole pull away after soldering
18. Resin voiding on inner track layer
19. Section of copper nobules
20. Void in silver polymer through connections
21. Multi layer junction failure
22. Resin contamination in copper plating
23. Poor solderability of through hole
24. Section showing voiding in multi layer
25. Section showing tented via hole
26. Marking ink contamination on resist
27. Resist lift and contamination under mask
28. Poor solder resist application
29. Cracking of solder resist coating
30. Solder mask ring in through hole
31. Variation of tin/lead coverage on PTH
32. Section showing poor drilling
33. Poor solderability of through hole
34. Poor solderability on knee of the hole
35. Section of tin/lead sliver
36. Section showing corner cracking
37. Electroless copper coverage of PTH
38. Section of multi layer junction
39. Section of multi layer junction
40. Close up of electroless copper coverage
41. Poor electroless copper back light test
42. Good electroless copper back light test
43. Voids in copper through hole plating
44. Cracked copper plating
45. Electroless copper coverage of PTH
46. Section of through hole plating
47. Damage to through hole plating
48. Good electroless copper back light test
49. Resist in plated through holes
50. Exposed tracks due to resist size
51. Misalignment of solder mask
52. Resist in plated through hole
53. Resist wrinkling after wave soldering
54. Solder pick-up after wave solder
55. Tented via hole blown out
56. Solder pick up after wave solder
57. Misaligned solder mask image
58. Example of resist side walls
59. Solder mask overlapping tin/lead pad
60. Solder resist lift after assembly
61. Example of resist side walls
62. Section through resist and track
63. Section through resist and track
64. Solder resist sliver
65. Excessive resist aperture
66. Excessive resist aperture
67. Resist overlap
68. Solder mask cracking
69. Solder mask cracking
70. Resist overlap
71. Contamination under mask
72. Solder mask cracking
73. Poor solderability
74. Poor solderability
75. Poor solderability
76. Poor solderability
77. Poor PTH solderability
78. Resist wrinkle
79. Plating failure
80. Uneven solder coating
81. Uneven solder coating
82. Resist wrinkle
83. Uneven solder coating
84. Poor pad solderability
85. Poor pad solderability
86. Poor PTH solderability
87. Poor pad solderability
88. Poor pad solderability
89. PCB heatsink bonding
90. SIPAD solder coating
91. Carbon contact pads
92. Polymer through hole
93. Polymer through holes
94. SIPAD solder coating
95. SIPAD solder coating
96. Polymer through hole
97. Legend pad contamination
98. Legend pad contamination
99. Welded track repair
100. Routed multilayer repair
101. Final track repair
102. Final track repair
103. Poor tin/lead strip
104. Poor tin/lead strip
105. Poor tin/lead coverage
106. Copper dendrite
107. Copper dendrite
108. Copper dendrite
109. Delamination
110. Local delamination
111. Tooling hole damage
112. Poor edge bevelling
113. Poor electroless copper
114. Poor copper etching
115. Multilayer X-ray
116. Via outgassing
117. Via outgassing
118. Poor tin/lead coverage
119. C pad design
120. Via hole breakout
121. Cover layer delamination
122. Flexible ring voiding
123. Flexible etch defects
124. Flexible track break
125. Flexible resin contamination
126. Flexible resin contamination
127. Poor solder coating
128. Copper contamination
129. Etching defects
130. Tin/lead smearing
131. Poor resist development
132. Poor resist stripping
133. Poor gold adhesion
134. Poor tin/lead plating
135. Poor solderability
136. Poor tin/lead coverage
137. Poor tin/lead coverage
138. Poor tin/lead coverage
139. Poor gold adhesion
140. Track etching defect
141. Legend ink section
142. Legend ink contamination
143. Legend ink contamination
144. Static ink whiskers
145. Punch out panel
146. Break out tab
147. Test pin damage
148. Test pin marks
149. Resist lifting
150. Gold pad contamination
151. Gold pad contamination
152. BSI test coupon panel
153. BSI test coupon panel
154. Plastic moulded PCB
155. Plastic moulded PCB
156. Plastic moulded PCB
157. Single side resin smear
158. Solder level skip
159. Bowed PCB
160. Laminate measelling
161. Surface contamination
162. Resin starvation
163. Poor SIPAD process
164. Poor SIPAD process
165. Photo resist defect
166. Incomplete coverlay removal
167. Solder mask ghosting
168. Legend smudging
169. Plastic moulded PCB
170. Loose glass strands
171. Burnt gold tabs
172. Etching faults
173. Etching faults
174. Thin solder mask
175. Measelling/lifted mask
176. Bowed PCB
177. Gold with solder dots
178. Solder ball pick up
179. Solder mask lift
180. Gold tab blooming
181. Local bond defects
182. Excess mask penetration
183. Over etching
184. Filmwork defects
185. Tin/lead strip residue
186. Poor legend cure
187. Resist ghost/Image defect
188. Tooling hole platting
189. Incorrect bevelling
190. Plating short
191. PTH voiding
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