Conventional Assembly Photo Album
The contents of the Conventional Assembly Photo Album is as follow:

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1 	Cored solder wire
2 	Historical soldering iron
3	Lifted PCB pads
4 	Leaching of hybrid metallisation
5 	Poor tin /lead pad wetting
6 	Poor hole to lead ratio
7 	Microsection of poor PTH knee wetting
8 	Microsection PTH knee damage
9 	Solder resist in plated through hole
10 	Microsection of multi-layer track separation
11 	Poor adhesion of solder mask
12 	Microsection of multi-layer resin smear
13 	Poor gold plate adhesion
14 	Microsection of poor PTH solderability
15 	Marking legend ink pad contamination
16 	Poor PTH copper plating
17 	Marking legend ink pad contamination
18 	De-wetting of tin/lead pads
19 	De-wetting of tin/lead pads
20 	Via hole pad breakout
21 	Uneven tin/lead plating on pads
22 	Microsection of satisfactory solder levelled pad
23 	Microsection of satisfactory plated through hole
24 	Solder resist failure on PCB track
25 	Microsection of PTH copper failure
26 	Microsection of pad plating
27 	Solder resist in plated through hole
28 	Bulbous solder fillets
29 	Poor through hole solder rise
30 	Poor component lead solderability
31 	Non-wetting of lead 
32 	Pin hole/blow hole in solder joint
33 	Solder short
34 	Solder spikes
35 	Solder mask lifting
36 	Poor soldering on flexible circuit pads
37 	Pin hole/blow hole in solder joint
38 	Satisfactory component lead length
39 	Satisfactory lead clinch
40 	Wave soldering solder balls
41 	Wave soldering solder balls
42 	Close-up of solder ball
43 	Minor solder spikes
44 	Cracked through hole joint
45 	Uneven lead length
46 	Lifted integrated circuit leads
47 	Single sided board assembly top view
48 	Wire insulation in solder joint
49 	Microsection of poor PTH solderability
50 	Poor pad solderability
51 	Poor pad solderability
52 	PCB topside solder short
53 	Poor topside solder fillets
54 	Microsection of poor topside solder fillets
55 	No topside solder fillets
56 	Cracked solder fillet
57 	Poor topside fillet due to heat loss
58 	Incomplete solder fillet
59 	Microsection of poor lead cutting
60 	Through hole component lift
61 	Poor topside solder fillets
62 	Poor topside solder fillets
63 	Microsection of poor lead cutting
64 	Corner pin contamination in solder joints
65 	Poor topside fillets
66 	Incomplete solder fillet
67 	Poor pin solderability
68 	Satisfactory topside fillet
69 	Solder pick-up on tracking due to resist failure
70 	Solder pick-up on tracking due to resist failure
71 	Satisfactory lead clinch
72 	Dross solder short
73 	Poor topside solder fillets
74 	Microsection of solder joint cracking
75 	Inconsistent topside fillets
76 	Sunken solder fillets due to outgassing
77 	Solder short
78 	Broken component lead
79 	Poor tin/lead pad solderability
80 	Inconsistent hand solder joints
81 	Cracked solder joint
82 	Pin hole in solder joint
83 	Solder resist wrinkle
84 	Incomplete topside fillets
85 	Component resin joint contamination
86 	PCB pad burring
87 	Solder sliver on joint
88 	Poor lead trimming
89 	Poor lead trimming
90 	Bulbous solder joint
91 	Lifted single side solder pad
92 	Solder joint crack
93 	Satisfactory solder joint
94 	Solder ball on PCB
95 	Solder short on PGA
96 	Solder ball attached to track
97 	Satisfactory clinched solder joints
98 	Satisfactory solder joint with resist on pads
99 	Incomplete solder joint
100 	Solder shorts
101 	Poor topside solder fillets
102 	Damage to PTH plating
103 	No topside solder fillet
104 	Poor topside solder fillets
105 	Multiple solder shorts
106 	Solder mask lifting due to tin/lead under resist
107 	Satisfactory solder joint on wire and pin termination
108 	Satisfactory topside solder fillets
109 	Satisfactory solder fillets
110 	Unsoldered via holes
111 	Satisfactory solder joints
112 	Satisfactory solder joint
113 	Flux residues on PCB
114 	Flux residues after hand soldering
115 	Flux corrosion topside of PCB
116 	Dendrite corrosion on PCB
117 	Dendrite corrosion across resist
118 	Dendrite corrosion under and over resist
119 	Cleaning attack on component coating
120 	Verdigris corrosion from copper
121 	Flux trapped under component
122 	Component glass seal cracking
123 	Microsection of non-wetting on component lead
124 	Poor solderability on brass terminations
125 	Component glass seal cracking
126 	De-wetting on component lead
127 	Poor lead plating on component
128 	Poor lead plating on component
129 	De-wetting on component lead
130 	De-wetting on component lead