1 BGA dumbbell pad
2 BGA pads with alignment marks
3 Dumbbell pads overlapping resist
4 BGA teardrop & alignment marks
5 BGA dumbbell pads open resist
6 BGA dumbbell overlapping resist
7 BGA pads with alignment marks
8 BGA showing alignment mark
9 BGA showing alignment marks
10 Poor solderability of BGA pads
11 Satisfactory pad solderability
12 Failed solderability test board
13 Satisfactory pad solderability
14 Poor solderability of gold pads
15 Close-up paste deposit
16 Paste deposit on teardrop pads
17 Paste deposit on teardrop pads
18 Paste slump on teardrop pads
19 Paste slump on teardrop pads
20 Paste on dumbbell pads
21 Paste smear on teardrop pads
22 Paste deposit on teardrop pads
23 Paste deposit on teardrop pads
24 Top view of plastic BGA
25 SMART Group dummy BGAs
26 Top view of plastic BGA
27 Side view of ceramic BGA & balls
28 Bottom view of BGA balls
29 Close-up of balls on ceramic BGA
30 Bottom view of Tessia micro BGA
31 Bottom view of IBM Tape BGA
32 Close-up of IBM Tape BGA
33 Close-up of Tessia BGA base
34 Bottom of plastic BGA
35 Close-up of BGA balls
36 Side view of ceramic hybrid BGA
37 Top view IBM Tape BGA
38 Close-up of balls on plastic BGA
39 Top of IBM plastic BGA encapsulate
40 Bottom view of ceramic hybrid BGA
41 Side view of ceramic hybrid BGA
42 Multi panel of BGAs
43 Close-up of balls on IBM Tape BGA
44 Base of over moulded plastic BGA
45 Close-up of balls on ceramic BGA
46 Base of balls on ceramic BGA
47 PBGA microsection through ball
48 Microsection through SMART demo
49 Microsection through SMART demo
50 Microsection through ball and pad
51 Microsection of ball, pad and resist
52 PBGA microsection of package
53 Microsection BGA joint area
54 Microsection BGA joint cracking
55 Microsection BGA joint cracking
56 Microsection BGA ball and joint
57 BGA joint minor voiding
58 BGA joint minor voiding
59 Satisfactory BGA joint
60 Close-up via mounted BGA joint
61 Close-up via mounted BGA joint
62 Via mounted BGA joint
63 Via mounted BGA joint
64 Via mounted BGA joint with voiding
65 Via mounted BGA joint
66 Via mounted BGA with incomplete fill
67 Bottom of BGA after shear test
68 Close-up after shear testing
69 Close-up of sheared balls
70 Side of ceramic BGA and joints
71 Top BGA view and alignment marks
72 Top BGA view misplaced with marks
73 Side of ceramic BGA and joints
74 Solder pre-form for BGA
75 Solder spikes after rework
76 Rework ball matrix
77 Rework ball matrix
78 Rework ball matrix
79 Rework ball matrix
80 Damaged resist after rework
81 BGA pads after satisfactory rework
82 BGA pads after rework
83 Solder balling on BGA footprint
84 Pads after rework with solder in vias
85 Via mounted BGA with voiding
86 Missing solder ball on BGA
87 Missing solder ball on BGA
88 Top view of plastic BGA
89 Microsection of die cracking
90 Popcorn cracking on side of BGA
91 Topside plastic BGA cracking
92 Close-up of cracking
93 Close-up of BGA cracking
94 Cracking of die attachment
95 Open circuit BGA joint
96 Open circuit BGA joint
97 Solder paste in via holes
98 Open circuit BGA joint
99 Open circuit BGA joint
100 Solder shorts after BGA removal
101 Solder in via holes
102 Solder protruding from vias
103 Solder short after BGA removal
104 Flux left after BGA removal
105 Solder paste in via holes
106 Misplaced solder paste deposit
107 Missing solder balls
108 Close-up of deformed BGA balls
109 Multi panel of BGA devices
110 Close-up precision solder balls
111 X-ray of BGA joints
112 X-ray of BGA shorts
113 X-ray of BGA short
114 X-ray of joints
115 X-ray of joints
116 X-ray of Joints
117 X-ray with missing ball
118 X-ray variable ball size
119 X-ray of minor voiding
120 X-ray of minor voiding
121 X-ray of misshapen balls
122 X-ray of misshapen balls
123 X-ray of incomplete reflow
124 X-ray of incomplete joint
125 X-ray missing balls and short
126 X-ray of short/insufficient joints
127 X-ray incomplete reflow and skewing
128 X-ray incomplete reflow and skewing
129 X-ray of minor voiding
130 X-ray voiding and misshapen balls
131 X-ray minor voiding
132 X-ray misshapen balls
133 X-ray minor voiding
134 As above
135 BGA microsection with void
136 Microsection with high temp. ball
137 As above
138 BGA microsection with void
139 Example of CSP
140 Microsection with high temp. ball
141 Microsection with high temp. ball
142 Example of CGA
143 Example of CGA
144 BGA with corner marks
145 Close up of a CSP
146 BGA microsection with void
147 BGA with corner marks
148 Close-up of a CSP
149 Close-up example of CGA
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