|
||||||
|
|
Lead-Free Design for Manufacture Assembly Workshop This workshop is aimed at Design, Production and Quality Engineers. It will provide a better understanding of the effect lead-free will have on printed board design, specification and procurement. Component specification and testing requirements to meet WEEE and RoHS will be discussed along with the simple guidance on ranking circuit board solder finishes. Layout changes that benefit a lead-free process will be highlighted as well as the subtle changes to improve yields on existing designs. Design modification that have been used to reduce or eliminate fillet lifting, pad lifting will be illustrated and their apparent success or failure. The workshop will cover the following key points: Component
specification, selection and WEEE & RoHS compatible Pin In Hole/Intrusive Reflow Implementation with Lead-Free Surface Mount Technology (SMT) is part of mainstream electronic assembly with virtually all market sectors benefiting from the use of SMT. One problem that has always proved an issue to design and process engineers is the use of existing through hole components where no direct equivalent SMT parts are available. Hence the interest in Pin in paste, intrusive reflow, multi spot soldering, regardless of the name it’s a perfect option to eliminate the wave soldering process. Bob produced the Worlds first training video, interactive CD-ROM, inspection standards and manual on intrusive reflow. His unique micro video clips provide an ideal way of understanding the technology and how to succeed. Selective soldering can provide excellent results but requires capital equipment investment. One method of soldering all surface mount and through hole components in a single operation is Pin-In-Hole-Reflow which simplifies the manufacturing process. Each delegate attending will receive a set of intrusive reflow inspection posters to aid their process introduction. The workshop will cover the following key points: PCB
Design and Component Requirements This Master Class is a practical introduction to the changes necessary in design, component selection, assembly and soldering with lead-free alloys. It covers the practical experience gained during lead-free trails, process introduction and running hands on lead-free lines and training events for the past 5 years. Bob presents a practical introduction to lead-free and illustrates many of the process stages and defects with his unique micro video photography which helps to bring the Master Class alive. Topics
included: Lead-Free Inspection, Process Control and Defect Elimination Lead-free assembly does have an impact on the design, manufacture and the potential reliability of printed board assemblies. Although the fundamental processes do not change, process parameters do change and there are process issues what are coming to light that do affect yields. This workshop will provide a practical insight into the inspection criteria, changes to process conditions and how to monitor the process to obtain the highest yields. The session will also illustrate the potential problems at each stage of manufacture and how to avoid them and where necessary changes to IPC criteria will be required. Monitoring solderability of boards and components in production with simple tests will be illustrated. Many of the instructors short lead-free video clips are used during the workshop to show how different alloys reflow, joints form and defects occur, making this session totally unique. Reflow Soldering Lead-Free Alloys - Successfully Reflow soldering with lead-free alloys is far less demanding to convert than wave. However there are new issues of material compatibility, higher temperatures, lead contamination and the benefits of using pin in hole/intrusive reflow to consider. During this workshop each of the key stages of the reflow process will be considered and delegates will see the results of many trials showing what works and does not in the real world of manufacture. With over six years experience with lead-free materials, processes and circuit board assembly most of the issues have now been overcome. The workshop features many typical lead-free defects and possible causes. With Bob Willis’s unique micro video clips delegates will easily understanding the issues they may face. Printed
Circuit Board Solderable Finishes for Fine Pitch The choice of solderable finishes applied to surface mount boards can have a significant effect on the assembly yield, bow and twist, misplacement, open joints and cost of the final circuit. Tin/lead solder levelled board are still in the majority but gold, tin, silver and OSP have been growing in popularity. The workshop will demonstrate all the options available and how to evaluate the best surface finish for assembly. Bob Willis will show some of the test methods used in production to test surface finishes along with some of his own no cost techniques. During the workshop delegates will see different process failure modes and be able to judge what is cosmetic and if reliability may be affected. Topics Include: Review of
solderable finishes Lead-Free Joints Rework and Repair Hand Soldering/De-Soldering Rework and repair of lead-free solder joints requires higher process temperatures, this can impact on the printed circuit board and components used today. The rework fluxes used and the equipment also require consideration along with greater attention to profiling board assemblies for rework. The session will provide a step by step guide to rework of all types of terminations and look at the potential problems faced with lead-free products. Attention will be payed to the types of defects that can be introduced when rework is not conducted correctly and what corrective actions need to be put in place. Lead-Free Wave Soldering Process Troubleshooting Do we have all the answers to successful lead-free wave soldering? No, and to quote a well known soldering metallurgist, “We don’t even know all the questions”. Lead-free is new to many and the wave soldering process is the most affected by the change of materials with cost increase in alloy, solder bath and copper erosion plus increased temperatures all makes process change demanding. During this workshop we will look at the practical experience to date and try to provide answers to as many questions that have come to light during early introduction. Topics Include: Cost of lead-free Ball Grid Array Inspection Lead-Free Defect Guide Area Array Technology is part of mainstream electronics but very little inspection criteria is available in the industry. The assembly process for BGAs is fairly well understood for tin/lead alloys but with the move to lead-free assembly there are critical issues to consider during inspection. The workshop covers optical and x-ray inspection of solder joints for both tin/lead and lead-free terminations. It includes an introduction to the lead-free assembly process with specific attention to BGA and area array devices. It provided a step by step guide to the procedure of inspection for optical and x-ray showing you how to do it. Inspection criteria are included for x-ray and visual criteria on different lead-free terminations and pad surfaces. Modern Lead-Free
Assembly Processes |
|
2
Fourth Avenue, Chelmsford, Essex, CM1 4HA, England |
Tel:
00(44) 1245 351502 Fax: 00 (44) 1245 496123 Email: bob@Askbobwillis.com |